AMD and Samsung have signed a memorandum of understanding (MoU) that includes the use of Samsung’s sixth-generation high-bandwidth memory (HBM4) chips in AMD’s next-generation AI GPUs. The agreement was signed during AMD CEO Lisa Su’s visit to Samsung Electronics’ semiconductor plant in Pyeongtaek, South Korea. During her first business trip to South Korea since becoming […]

AMD and Samsung have signed a memorandum of understanding (MoU) that includes the use of Samsung’s sixth-generation high-bandwidth memory (HBM4) chips in AMD’s next-generation AI GPUs. The agreement was signed during AMD CEO Lisa Su’s visit to Samsung Electronics’ semiconductor plant in Pyeongtaek, South Korea. During her first business trip to South Korea since becoming […]