Samsung’s Exynos 2700 SoC for Galaxy S27 series to reportedly ditch WLP technology

Samsung’s next-generation flagship chipset, the Exynos 2700, could adopt a new packaging design, according to a recent report. The company is reportedly planning to move away from Fan-Out Wafer-Level Packaging (FOWLP) technology for the upcoming SoC. Fan-Out Wafer-Level Packaging (FOWLP), which Samsung has used since the Exynos 2400, reportedly helped improve thermal performance. However, the […]

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Verizon joins Project Glasswing to test Anthropic’s Claude Mythos model on its infrastructure

Today Verizon is announcing that it’s joining Anthropic’s Project Glasswing to test the Claude Mythos Preview model. This model, according to Anthropic, is capable of identifying complex vulnerabilities in critical software and operating systems at unprecedented speed. Due to its specialized capabilities, Anthropic set up Project Glasswing as a way to grant access to the […]

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