Samsung’s Exynos 2700 SoC for Galaxy S27 series to reportedly ditch WLP technology
Samsung’s next-generation flagship chipset, the Exynos 2700, could adopt a new packaging design, according to a recent report. The company is reportedly planning to move away from Fan-Out Wafer-Level Packaging (FOWLP) technology for the upcoming SoC. Fan-Out Wafer-Level Packaging (FOWLP), which Samsung has used since the Exynos 2400, reportedly helped improve thermal performance. However, the […]
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