Samsung’s next in-house flagship processor will be the Exynos 2700, and it is set to debut with the Galaxy S27 and the Galaxy S27+ in early 2027. Months ahead of the official announcement, a detailed die shot of the upcoming chip has leaked.

Based on the die shot published by SemiAnalysis, the Exynos 2700 features a 10-core CPU, an Xclipse 970 GPU, and a large NPU. The chip is reportedly fabricated on Samsung Foundry’s second-generation 2nm process, which is called SF2P.

According to SemiAnalysis’ breakdown, the chip has two Arm C2 Ultra CPU cores, each operating at different clock speeds (4.24 GHz and 3.36 GHz, respectively). Additionally, there are eight C2 Pro CPU cores: four running at 3.74 GHz and the remaining four clocked at 2.88 GHz.

This is an unconventional CPU core configuration, as the chip uses two prime CPU cores and omits traditional power-efficient (efficiency) cores entirely. Previous processors, such as the Exynos 2600, relied on a single prime core. In this regard, the Exynos 2700 is similar to Apple’s A-series chips, which also employ two prime cores.

Moreover, the processor includes a massive 24MB system-level cache (SLC). It is a memory buffer sitting between the CPU, GPU, NPU, and main memory to accelerate data sharing across components. Alongside the 24MB SLC, the upcoming Exynos chip features four 4MB Level 3 (L3) cache banks dedicated to the CPU.

This is a combined cache of 40MB, which is close to the total cache of Xiaomi’s recently announced Xring O3 chip and higher than the 24MB cache found in MediaTek’s Dimensity 9500 and Qualcomm’s Snapdragon 8 Elite Gen 5. However, it remains below the Apple A19 Pro’s 54MB cache.

The Xclipse 970 GPU inside the Exynos 2700 occupies a substantial portion of the die area and has eight workgroup processors (WGPs) with two compute units (CUs) each, totaling 16 CUs. Rumors suggest it is built on AMD’s RDNA 5 architecture, which has yet to be officially launched by AMD. It is potentially one of the most powerful GPUs available in a mobile processor.

Samsung’s upcoming processor also features four 64-bit LPDDR6 PHYs, paving the way for the Galaxy S27 series to adopt LPDDR6 memory, an upgrade over the LPDDR5X RAM used in recent high-end Galaxy devices.

There doesn’t appear to be an integrated modem, just like the Exynos 2600. So, Samsung will definitely use an external 5G modem for cellular capabilities. Bluetooth, Wi-Fi, GPS, and NFC components will also be likely offerd via an external chip.

Based on this leaked annotated floorplan, the Exynos 2700 appears to be Samsung’s most advanced and powerful mobile chip to date. Rumors indicate that it will have performance advantages over Qualcomm’s upcoming Snapdragon 8 Elite Gen 6 series in both CPU and GPU workloads.

Ultimately, only real-world benchmarks and testing will determine whether the Exynos 2700 can surpass its competitors from Apple, MediaTek, and Qualcomm in both raw performance and power efficiency.

Samsung’s next in-house flagship processor will be the Exynos 2700, and it is set to debut with the Galaxy S27 and the Galaxy S27+ in early 2027. Months ahead of the official announcement, a detailed die shot of the upcoming chip has leaked.

Based on the die shot published by SemiAnalysis, the Exynos 2700 features a 10-core CPU, an Xclipse 970 GPU, and a large NPU. The chip is reportedly fabricated on Samsung Foundry’s second-generation 2nm process, which is called SF2P.

According to SemiAnalysis’ breakdown, the chip has two Arm C2 Ultra CPU cores, each operating at different clock speeds (4.24 GHz and 3.36 GHz, respectively). Additionally, there are eight C2 Pro CPU cores: four running at 3.74 GHz and the remaining four clocked at 2.88 GHz.

This is an unconventional CPU core configuration, as the chip uses two prime CPU cores and omits traditional power-efficient (efficiency) cores entirely. Previous processors, such as the Exynos 2600, relied on a single prime core. In this regard, the Exynos 2700 is similar to Apple’s A-series chips, which also employ two prime cores.

Moreover, the processor includes a massive 24MB system-level cache (SLC). It is a memory buffer sitting between the CPU, GPU, NPU, and main memory to accelerate data sharing across components. Alongside the 24MB SLC, the upcoming Exynos chip features four 4MB Level 3 (L3) cache banks dedicated to the CPU.

This is a combined cache of 40MB, which is close to the total cache of Xiaomi’s recently announced Xring O3 chip and higher than the 24MB cache found in MediaTek’s Dimensity 9500 and Qualcomm’s Snapdragon 8 Elite Gen 5. However, it remains below the Apple A19 Pro’s 54MB cache.

The Xclipse 970 GPU inside the Exynos 2700 occupies a substantial portion of the die area and has eight workgroup processors (WGPs) with two compute units (CUs) each, totaling 16 CUs. Rumors suggest it is built on AMD’s RDNA 5 architecture, which has yet to be officially launched by AMD. It is potentially one of the most powerful GPUs available in a mobile processor.

Samsung’s upcoming processor also features four 64-bit LPDDR6 PHYs, paving the way for the Galaxy S27 series to adopt LPDDR6 memory, an upgrade over the LPDDR5X RAM used in recent high-end Galaxy devices.

There doesn’t appear to be an integrated modem, just like the Exynos 2600. So, Samsung will definitely use an external 5G modem for cellular capabilities. Bluetooth, Wi-Fi, GPS, and NFC components will also be likely offerd via an external chip.

Based on this leaked annotated floorplan, the Exynos 2700 appears to be Samsung’s most advanced and powerful mobile chip to date. Rumors indicate that it will have performance advantages over Qualcomm’s upcoming Snapdragon 8 Elite Gen 6 series in both CPU and GPU workloads.

Ultimately, only real-world benchmarks and testing will determine whether the Exynos 2700 can surpass its competitors from Apple, MediaTek, and Qualcomm in both raw performance and power efficiency.