TSMC’s new packaging technology will bring down chip cost and improve performance
According to sources familiar with the matter, TSMC is working on a cutting-edge technology for chip packaging called CoPoS. CoPoS means Chip-on-Panel-on-Structure, and it uses a glass material that acts as a temporary carrier, and it also goes into the final substrate with a three-layer sandwich structure. Reportedly, TSMC will start mass production of chips […]
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